FOB/FOG TAB Bonding Machine
FOG/FOB Bonding Machine
1.Application：
This Machine is used to bonding FPC、COF、TAB and LCD Panel，PCB for the TP
LCD Panels.
2.Parameter
| No. | Item | Spec. |
| 2.1 | Panel&Glass | Available Size：7-85inch |
| 2.2 | FPC/COF/TAB | 1）Thickness：0.1-1mm；
2）Length：5-60mm； 3）Pitch:≥0.01mm； |
3. Equipment Performance
| No. | Item | Spec. |
| 3.1 | Technology Process | 1） Put Panel on the platform,turn on Vacuum and absorb tightly ；
2）Turn on FPC Vacuum,，and absorb the FPC on Jig； 3）Turn Over FPC Jig，Manually Regulate X-Y-θ to locate； 4） Press Double-Start Button,Pressure Head heating,underdraught,Bonding. |
| 3.2 | Theory capacity | 150-200Sec/Pcs |
| 3.3 | Failure Rate | ≤0.01% |
4. Equipment and unit Parameter
| No. | Item | Spec. |
| 4.1 | Demand Power | AC220V 50-60Hz±10％ 50HZ 3.0KW |
| 4.2 | compressed air | 1）windpipe color：Black；
2）windpipe diameter：￠8mm ； 3）working pressure： 0.4-0.8Mpa ； 4）Air Comsumption:≈50L/min； |
| 4.3 | Vacuum | 1）Vacuum Control Mode：Vacuum Pump+Vacuum Generator
2) Vacuum Windpipe Color:Black； |
| 4.4 | Color | Painted Surface Finished |
| 4.5 | G.W | In kind prevail |
| 4.6 | Dimension | The static size：L2220*W1750*H1590mm(Not including the alarm lamp)
Max size during working： L3020*W1750*H1590mm |
| 4.7 | Control Unit | 1）Touch Panel：7inch，Man-machine Interface ;
2）resolution ratio：1024×768； 3）Control System（LG-LS） Program Processor； 4）Pressure Meter：KITA ,Digital Display Pressure Meter 5）Pressure Regulate：Japan SMC，Precision Pressure Regulating Valve ； 6）Pressure Precision：±0.5% in full； 7）Sensitivity：0.2% in full； 8）Pressure Unit：Kg/N/Mpa/Kpa swap ； |
| 4.8 | Operate Interface Unit | Language:English/Chinese(Optional)；
1）Parameter set interface:can set and display the parameter； 2）Auto Mode； 3）Manual Mode； 4）Abnormal Alarm； 5）Touch Panel Code（Optional）； |
| 4.9 | Hot Pressure Head Unit | 1）Heat Method：pulse heating；
2）Pressure Head Spec.：customize 3）Extrusion fixture: quartz 4）Thermocouple：”K” type； 5）Head Materials：titanium alloy，flatness:±4um； 6）Hot Press Time：0.1-999s,(0.1S as the setting unit); 7）Head Level Regulate Method:Manually； 8）Locating Regulate：X.Y.θMicrometer fine-tuning； 9）Temperature Range：RT-500℃； 10）Head Length：55X1.5MM(OEM) 11）Silicon Rape Holder：12mm Width(OEM) 12）Temperature difference: ±5℃ 13）Cylinder Diameter mm:40￠ |
